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0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing

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0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing

0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing
0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing 0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing 0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing 0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing 0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing

Large Image :  0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing

Product Details:
Place of Origin: China
Brand Name: XUANCAI
Certification: CE ROHS LM-80
Model Number: 365 UV LED
Payment & Shipping Terms:
Minimum Order Quantity: 100 PCS
Price: $0.5-$ 1/ PCS
Packaging Details: Blister box packaging
Delivery Time: 4-7 days
Payment Terms: T/T, Western Union, Paypal , Alibaba trade assurance
Supply Ability: 30000000 PCS/ Month

0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing

Description
Model: 365NM UV LED Size: 35*35
Power: 0.2W Current: 60mA
Voltage: 2-2.4V Luminous Flux: 5-7LM
Wavelength: 620-625NM Chip Brand: Epileds
Wire: 99.99 Gold Wire Viewing Angle: 120
Spanlife: 50,000 Hours Warranty: 3 Years
High Light:

Chip Uv Led 365nm

,

Uv Led 365nm High Power

,

Uv 365nm Led

UV 365 LED Chip Korea LG Chip Good Quality 45*45 3 Years' Warranty 1600-2000mW CE ROHS For 3D Printing/ Ink Curing

 

Applications

ultraviolet disinfection/ uv curing/ UV Ink Curing/ Printing/ Moth-killing lamp/ l Medical treatment and health/ General use

 

Product Parameters

 

Product Information
Item
 3W SMD LED
Size
  35*35
Current
    700mA 
Voltage
 3.2-3.8V
Wavelength
   365-370nm
Chip Brand
   LG
Quantity/ Reel
    1000pcs
Warranty
Spanlife

 

  3 Years 
50000 hours

 

Features

1. Size(mm): 3.45×3.45×1.95         

2. Ceramic and silicone molding package    

3. Suitable for all SMT assembly and solder process    

4. Wide viewing angle: 120°            

5. Pb-free reflow soldering application         

6. RoHS compliant 

 

 

Package Dimensions

0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing 0

 

 

Typical Optical/ Electrical Characteristics @Ta=25

Symbol

            Item

Min.

Typ.

Max.

Units

Test Conditions

 

Ie Radiant intensity mW/sr IF=700mA
Φe Radiation Power 1200 1500 mw IF=700mA
VF Forward Voltage 3.2 3.8 v IF=700mA
λd Wave length nm IF=700mA
λp PeakWavelength 365 370 nm IF=700mA
20-1/2 50% power angle 120   deg IF=700mA
IR Reverse Current 20 uA VR = 5V

 

 

 

Electro-Optical Characteristics (Ta=25℃)

                 Item

Symbol

 

Absolute Maximum Rating

 

    Units

Power dissipation Pd

 

3

W
DC Forward Current IF 700 mA
Peak Forward Current IFp 800 mA
Reverse Voltage VR 5 V
Operating Temperature Topr -20 ~ +85 ℃
Storage Temperature Tstg -40 ~ +100 ℃
Junction Temperature Tj 100°C
 
 

Tapping specifications (Units: mm)

Tape Dimensions: Loaded Quantity 1000pcs per reel

0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing 1

 


Application

 

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0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing 4

 

 

Precautions for use :

 

Soldering

SMD LED encapsulation gumwater is flexible, and external force easily damages radiant surface and plastic shell.So when soldering , Please handle with care!

A. Reflow soldering shall be not more than two times and is suggested to be taken under reflow curve conditions with No-clean Flux, .The radiant surface shall be clean and unclean surface may influence the emitting color.

B. Manual soldering is only used for reparing. Anti-static iron (25W) is recommended and tweezer or iron should not touch the radiant surface and plastic parts. The soldering time should be not more than 3 seconds.

C. Don’t twist LED in course of manual soldering and testing, which may cause LED failure.

D. Please select the LED devices in the same BIN on the same PCB, otherwise may cause chromatic aberration.

 

Cleaning

A . Ultrasonic cleaning is not allowed. We recommend isopropyl alcohol or pure alcohol to for cleaning or dipping within 1 minute and reuse after 15 minutes in room temperature. LThe radiant surface shall be clean after cleaning and other wisemayh influence radiant color.

B. Isoamyl acetate, trichloroethylene, acetone, sulfide, nitride, acid, alkali and salt shall be avoided from LED, which may cause damage to LED.

 

Encapsulation

A . Encapsulation glue containing sodium ion or sulfide shall be avoided, which may cause fading fluorescence powder (poisoning).

B . When using normal encapsulation glue, trial testing is recommended for 168-hour operation before mass production.

 

Storage

A. The LED should be stored at 30℃ or less and 60%RH or less before opening the package. The storage shall not be over half a year.

B. After opening the package, the LEDs should be kept at 30-35%RH or less, and should be used within 3 days.

C. When temperature card shows 20% above after package opened, baking treatment shall be conducted before use(for reel package,: baking at 60±3℃ for 12 hrs; for bulk goods, baking at 120±5℃ for 4 hrs)

D. Acid, alkali and corrosive gas should be avoided in storage environment and intensively shock and high magnetic field also avoided.

 

 

 

 

Trade Show

 
 

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0.2W 2000mW Chip Uv Led 365nm High Power For 3DInk Curing 6

 

 

 

 

Contact Details
Shenzhen Xuancai Electronic Co., Ltd

Contact Person: Skye Lin

Tel: 8613476793642

Send your inquiry directly to us (0 / 3000)