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Product Details:
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| Model: | 300W PCB SMD Board | Size: | 190*190MM |
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| Power: | 300W | Voltage: | 150V |
| Current: | 1800mA | Luminous Efficacy: | 140-150LM/W |
| CRI: | 80 | Aluminum Substrate Thickness: | 2.0MM |
| Thermal Conductivity: | 2.0W | Copper Foil: | 35UM |
| Warranty: | 3 Years Warranty | ||
| High Light: | smd led pcb board,300W led pcb board,aluminium pcb for led |
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300W Gold Wire Package Aluminum LED PCB SMD 3030 With High Thermal Conductivity For High Bay Light
Product Description
Specification
Related products Parameters
| The scope of products | Specification | Series-Parallel | Current /Voltage | Luminous Efficacy | Luminous Efficacy |
| High bay light | 100 WΦ150MM | 10B5 C*2 | (1500MA 30V) * 2 | 130-140LM/W | 140-150LM/W |
| 150 WΦ150MM | 10B5 C*3 | (1500MA 30V) * 3 | 130-140LM/W | 140-150LM/W | |
| 200 WΦ190MM | 10B5 C*4 | (1500MA 30V) * 3 | 130-140LM/W | 140-150LM/W | |
| 250 WΦ190MM | 10B5 C*5 | (1500MA 30V) * 5 | 130-140LM/W | 140-150LM/W | |
| 300 WΦ190MM | 10B5 C*6 | (1500MA 30V) * 6 | 130-140LM/W | 140-150LM/W | |
| 100 WΦ150MM | 50C 2B | 600MA 150V | 130-140LM/W | 140-150LM/W | |
| 150 WΦ150MM | 50C 3B | 900MA 150V | 130-140LM/W | 140-150LM/W | |
| 200 WΦ190MM | 50C 4B | 1200MA 150 V | 130-140LM/W | 140-150LM/W | |
| 250 WΦ190MM | 50C 5B | 1500MA 150 V | 130-140LM/W | 140-150LM/W | |
| 300 WΦ190MM | 50C 6B | 1800MA 150 V | 130-140LM/W | 140-150LM/W |
Application
High Bay light/ Chandeliers/ Tower pendant lamp/ Flood light
User Manuel
Storage
To avoid moisture, we recommend storage conditions for the unopened LED +5 ~ +30℃ rela-tive humidity <60%. LED should be used within 168 Hrs. of opening the package. Please make sure to dehumidify and vacuum pack the remaining/ unused LED. Dehumidifying condition:
+120℃±5℃ of 4Hrs. Effective age for the sealed led is one year.
The soldering precautions
Soldering conditions: Reflow soldering is not recommended for this LED. If hand soldering, set sol-dering iron temperature at 350℃ and soldering time not More than 5 seconds, after the first soldering, make sure the substrate surface temperature returns to ambient temperature before a second soldering. Please. make sure when soldering, there is no external force on the soldering surface and silicon batardeau (such as pressure, friction or sharp metal nails, etc.), to avoid gold wire deformation or dam-age and other abnormalities. If beyond recommended conditions, we cannot guarantee the LED stability, please do the risk assessment first. During assembly, please ensure that a good quality thermal paste is applied and distributed evenly over the surface. While using thermal pad (Heat Sink), make sure LED is firmly tightened and there is no gap between surfaces. In such heat-media products, through a pressure test of at least 500 volts.
Anti-static measures
Please take adequate measures to prevent electrostatic generation, such as wearing electrostatic ring or anti-static fingerstall etc; any relative products like plant equipment, machinery, carrier and transpor-tation units shall be connected to discharging unit/ ground. The ESD sensitivity of this product is > 1000V(HBM), after assembly the final lamp, please make sure to discharge Static Electricity by proper ESD equipment.
Temperature control
Recommended temperature conditions for enhanced product life: Be sure to TS point (negative pads) controlled below 85℃, COB recommendation colloid surface temperature control ≤150℃.
The drive control
Drive this product at constant current. Output current range specifications should be ac-cording to the operational and other conditions, as mentioned in data sheet. Before using a constant voltage source or altered specifications other than recommended, please consider risk factors.
Trade Show
Contact Person: Skye Lin
Tel: 8613476793642
