2835 0.2W SMD LED Chip

Factory Supplier 2835 SMD 0.2W 0.5W 1W 130-140LM/W Sanan Chip SMD LED For Panel Light/ Ceiling

Product Parameters

Features:

1.1 Package Size: 3.48*2.74*0.7mm

1.2 Silicone Packed

1.3 Emitted Color: White colors are available in 3000K, 4000K, 6000K

1.4 Light-emitting Type

1.5 Soldering Method: SMT Reflow Soldering

1.6 RoHS standard complied.

Package Outline Dimension:

Absolute Maximum Ratings(Ta=25℃)

Power Dissipation: 1000mW

Forward Current: 100mA

Peak Pulse Current*1: 200mA

Reverse Voltage: 5V

Soldering Tempearure: 240 (for 10 seconds) ℃

Operating Temperature: -40℃~85℃

Storage Temperature: -40℃~85℃

Junction Temperature: 125 ℃

Electrostatic discharge: 2000V

Foward Voltage: 8.8-9.4V

Luminous Intensity: 140-150LM/W

Viewing Angle: 120 deg

Color rendering index: 80

Correlated Color Temperature: 2700K 3000K 4000K 5000K 6500K 

Reverse Current: 1μA

Tapping specifications (Units: mm)

Loaded quantity: 4000 pcs/reel

Application

Precautions for use :

Soldering

SMD LED encapsulation gumwater is flexible, and external force easily damages radiant surface and plastic shell.So when soldering , Please handle with care!

A. Reflow soldering shall be not more than two times and is suggested to be taken under reflow curve conditions with No-clean Flux, .The radiant surface shall be clean and unclean surface may influence the emitting color.

B. Manual soldering is only used for reparing. Anti-static iron (25W) is recommended and tweezer or iron should not touch the radiant surface and plastic parts. The soldering time should be not more than 3 seconds.

C. Don’t twist LED in course of manual soldering and testing, which may cause LED failure.

D. Please select the LED devices in the same BIN on the same PCB, otherwise may cause chromatic aberration.

Cleaning

A . Ultrasonic cleaning is not allowed. We recommend isopropyl alcohol or pure alcohol to for cleaning or dipping within 1 minute and reuse after 15 minutes in room temperature. LThe radiant surface shall be clean after cleaning and other wisemayh influence radiant color.

B. Isoamyl acetate, trichloroethylene, acetone, sulfide, nitride, acid, alkali and salt shall be avoided from LED, which may cause damage to LED.

Encapsulation

A . Encapsulation glue containing sodium ion or sulfide shall be avoided, which may cause fading fluorescence powder (poisoning).

B . When using normal encapsulation glue, trial testing is recommended for 168-hour operation before mass production.

Storage

A. The LED should be stored at 30℃ or less and 60%RH or less before opening the package. The storage shall not be over half a year.

B. After opening the package, the LEDs should be kept at 30-35%RH or less, and should be used within 3 days.

C. When temperature card shows 20% above after package opened, baking treatment shall be conducted before use(for reel package,: baking at 60±3℃ for 12 hrs; for bulk goods, baking at 120±5℃ for 4 hrs)

D. Acid, alkali and corrosive gas should be avoided in storage environment and intensively shock and high magnetic field also avoided.

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